1/8 may 2003 . STS6PF30L p-channel 30v - 0.027 w - 6a so-8 stripfet? power mosfet n typical r ds (on) = 0.027 w n standard outline for easy automated surface mount assembly n low threshold drive description this power mosfet is the latest development of stmicroelectronis unique "single feature size?" strip-based process. the resulting transistor shows extremely high packing density for low on- resistance, rugged avalanche characteristics and less critical alignment steps therefore a remark- able manufacturing reproducibility. applications n mobile phone applications n dc-dc converters n battery management in nomadic equipment type v dss r ds(on) i d STS6PF30L 30 v <0.030 w 6 a information furnished is believed to be accurate and reliable. however, stmicroel of use of such information nor for any infringement of patents or other rights of third by implication or otherwise under any patent or patent rights of stmicroelectroni c to change without notice. this publication supersedes and replaces all informatio n authorized for use as critical components in life support devices or systems witho u the st logo is registered trademark of st a 2003 stmicroelectronics - all rig h all other names are the property of their re stmicroelectronics group of c o australia - brazil - china - finland - france - germany - hong kong - in singapore - spain - sweden - switzerland - un http://www.st.com so-8 absolute maximum ratings ( ) pulse width limited by safe operating area. note: for the p-channel mosfet actual polarity of voltages and current has to be reversed symbol parameter value unit v ds drain-source voltage (v gs = 0) 30 v v dgr drain-gate voltage (r gs = 20 k w ) 30 v v gs gate- source voltage 16 v i d drain current (continuous) at t c = 25c 6a i d drain current (continuous) at t c = 100c 3.8 a i dm ( ) drain current (pulsed) 24 a p tot total dissipation at t c = 25c 2.5 w internal schematic diagram
STS6PF30L 2/8 thermal data electrical characteristics (t case = 25 c unless otherwise specified) off on (* ) dynamic rthj-amb t j t stg thermal resistance junction-ambient maximum lead temperature for soldering purpose storage temperature max typ 50 150 -55 to 150 c/w c c symbol parameter test conditions min. typ. max. unit v (br)dss drain-source breakdown voltage i d = 250 a, v gs = 0 30 v i dss zero gate voltage drain current (v gs = 0) v ds = max rating v ds = max rating t c = 125c 1 10 a a i gss gate-body leakage current (v ds = 0) v gs = 16 v 100 na symbol parameter test conditions min. typ. max. unit v gs(th) gate threshold voltage v ds = v gs i d = 250 a 1 1.6 2.5 v r ds(on) static drain-source on resistance v gs = 10 v i d = 3 a v gs = 5 v i d = 3 a 0.027 0.034 0.030 0.042 w w symbol parameter test conditions min. typ. max. unit g fs (*) forward transconductance v ds =10 v i d =3 a 12 s c iss c oss c rss input capacitance output capacitance reverse transfer capacitance v ds = 25v, f = 1 mhz, v gs = 0 1670 345 120 pf pf pf
3/8 STS6PF30L switching on (* ) switching off (* ) source drain diode (* ) (*) pulse width [ 300 s, duty cycle 1.5 %. ( ) pulse width limited by t jmax symbol parameter test conditions min. typ. max. unit t d(on) t r turn-on delay time rise time v dd = 15 v i d = 3 a r g = 4.7 w v gs = 5 v (resistive load, figure 1) 62 140 ns ns q g q gs q gd total gate charge gate-source charge gate-drain charge v dd = 24v i d = 6a v gs =5v (see test circuit, figure 2) 21 3.9 8.6 28 nc nc nc symbol parameter test conditions min. typ. max. unit t d(off) t f turn-off delay time fall time v dd = 24 v i d = 3 a r g = 4.7 w, v gs = 5 v (resistive load, figure 1) 57 19 ns ns symbol parameter test conditions min. typ. max. unit i sd i sdm ( ) source-drain current source-drain current (pulsed) 6 4 a a v sd (*) forward on voltage i sd = 6 a v gs = 0 1.2 v t rr q rr i rrm reverse recovery time reverse recovery charge reverse recovery current i sd = 6 a di/dt = 100a/s v dd = 15 v t j = 150c (see test circuit, figure 3) 37 46.3 2.5 ns nc a electrical characteristics (continued) safe operating area thermal impedance
STS6PF30L 4/8 output characteristics transfer characteristics transconductance static drain-source on resistance gate charge vs gate-source voltage capacitance variations
5/8 STS6PF30L normalized gate threshold voltage vs temperature normalized on resistance vs temperature source-drain diode forward characteristics normalized breakdown voltage vs temperature . .
STS6PF30L 6/8 fig. 2: gate charge test circuit fig. 3: test circuit for diode recovery behaviour fig. 1: switching times test circuits for resistive load
7/8 STS6PF30L dim. mm inch min. typ. max. min. typ. max. a1.750.068 a1 0.1 0.25 0.003 0.009 a2 1.65 0.064 a3 0.65 0.85 0.025 0.033 b 0.35 0.48 0.013 0.018 b1 0.19 0.25 0.007 0.010 c 0.25 0.5 0.010 0.019 c1 45 (typ.) d 4.8 5.0 0.188 0.196 e 5.8 6.2 0.228 0.244 e1.27 0.050 e3 3.81 0.150 f 3.8 4.0 0.14 0.157 l 0.4 1.27 0.015 0.050 m0.60.023 s 8 (max.) 0016023 so-8 mechanical data
STS6PF30L 8/8 information furnished is believed to be accurate and reliable. however, stmicroelectronics assumes no responsibility for the co nsequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of stmicroelectronics. specifications mentioned in this publicati on are subject to change without notice. this publication supersedes and replaces all information previously supplied. stmicroelectronics prod ucts are not authorized for use as critical components in life support devices or systems without express written approval of stmicroelectro nics. the st logo is registered trademark of stmicroelectronics a 2003 stmicroelectronics - all rights reserved all other names are the property of their respective owners. stmicroelectronics group of companies australia - brazil - canada - china - finland - france - germany - hong kong - india - israel - italy - japan - malaysia - malt a - morocco - singapore - spain - sweden - switzerland - united kingdom - united states. http://www.st.com
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